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SMT SMD 1808 Fuse 250mA-15A – Fast Acting Ceramic Surface Mount 2410
SMT/SMD – 1808/2410 Fast Acting Fuse – Wire-In-Air (WIA) square-shaped surface mount fuse 6.1mm x 2.69mm x 2.69mm – Rated to 250V (250mA, 500mA, 1UM, 2UM, 3UM, 5UM) – Rated to 125V (8UM, 10UM, 12UM, 15UM) .
 Fast Acting Ceramic Surface Mount 2410 Fuse |
 20A 25A 30A 40A Ceramic fuse 1808 2410 6125 6.1 2.5MM Surface Mount Fuses |
 1808 2410 SMD Fuse Fast Acting Ceramic Fuse Surface Mount 250V 300V SMT Chip fuse |
| Nome do item: | 1808 SMD Fuse Fast Acting Ceramic Fuse Surface Mount Chip For Com-Communications | Número da peça: | SEF SSF SFE |
| Tipo de sopro: | Fast Acting, Quick Blow | Tipo de montagem: | Montagem em superfície |
| Padrão: | UL 248-14 | Material corporal: | Cerâmica |
| Material de capital: | Gold Or Silver Plated Brass | Material de fusão: | Cu-Ag Alloy |
| Classificação de tensão: | 125V 250V 300V | Classificação atual: | 0.25A~15A |
| Applied To: | 6.1×2.5×2.5milímetros | Ul listado: | Sim |
| Compatível com RoHS: | Sim | Livre de halogênio: | Sim |
| MPQ: | 1000pcs Per Reel | ||
| Destaque: | 15A Surface Mount Fuses, 6.1mm Surface Mount Fuses, 1808 SMD Fuse | ||
Descrição do produto
1808 SMD Fuse Fast Acting Ceramic Fuse Surface Mount Chip for Com-Communications
| Item | SMD Fuse |
| Padrão | UL |
| Tipo de sopro | fast blow |
| Material corporal | cerâmica |
| Material de fusão | Cu-Ag alloy |
| Material de capital | brass, plated with silver or gold |
| Classificação de tensão | 250V 125V 300V |
| Classificação atual | 0.05A~15A |
| Tipo de montagem | Montagem em superfície |
| Quebrando Capacidade | 50UM |
| Tamanho | 6.1×2.5.x2.5mm |
| Certificações | Cul |
Product Features of Surface mount ceramic chip fuse
Tamanho pequeno(6.1mm*2.5mm)
Conflict free metals
Lead-Free and RoHS compliant
lnrush with stand capability
Wide range of current rating (125V/250V/30oV)
Wide range of current rating (50mA-15A)
Excellent environmental integrity
Wide rangc of current rating availablcLow temperature de-rating
Tape and Reel for automatic SMT placement
Aplicativos
| LED lighting | Networking devices | Game console |
| Notebook PC | PC server | Office equipment |
| Battery devices | Cooling fan system | Digital camera |
| LCD/PDP devices | Storage system | Medical equipment |
| LCD backlight inverter | Telecom system | Automotive devices |
| Portable Devices | Wireless base station | LED driver |
| Fonte de energia | White goods | lndustrial equipment |
Temperatura operacional: -55℃ to +125℃ (Considere a de classificação)
Condição armazenada: à temperatura de +10 ℃ ~ 60 ℃, umidade relativa ≤ 75%.
UM:Temperatura da panela de solda: 260℃ Máx.; Solda Horário de Horário: <5é (Wave Soldering)
B:Solder Iron Temperature: 350±5℃, heating time: 1~2s. (Hand Soldering)
Drawing of the 1808 2410 250V 300V SMD fuse
Electrical Characteristics at 25℃
| Ampere Rating | % of Current Rating | Tempo de sopro |
| 0.05A~15A | 100% | >4 horas |
| 0.05A~15A | 200% | <120sec |
Normal amperes: 250mA 315mA 375mA 0.4A 0.5A 0.63A 0.75A 0.8A 1A 1.25A 1.6A 2A
2.5A 3A 3.15A 3.5A 4A 5A 6.3A 7A 8A 12A 15A (125V 250V 300V)
Observação: (1) Permissible continuous operating current is ≤100% at ambient temperature of 23°C (73.4°F)
(2) The current values used for calculating I2T should be within the standard 10In.
(3) The TUV certification only for 250VAC and 125VDC; the CQC, KC certification only for 250V; the cURus certification for all voltage.
(4) 250mA No sand filling
SMT SMD 1808 Fuse Selection
Drawing of the 1808 2410 250V 300V SMD fuse
Average Current Curve (I-T Curve)
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