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bussmann 1245 UMF Ceramic SMD Chip Fuse 32V 63V Surface Mount
The Bussmann 1245 SMD Chip Fuse 32V 63V Surface Mount Fuses are electronic components designed to protect circuits by breaking the electrical connection in the event of excessive current.
The Bussmann 1245 SMD Chip Fuse 32V 63V Surface Mount Fuses are electronic components designed to protect circuits by breaking the electrical connection in the event of excessive current.
 1245HC high current SMD 32V 63V Surface Mount Fuses |  表面貼裝, 40 一個, Fast Acting, 250 VAC （交流電）, 72 VDC直流電, 4818 1245 Metric |  1245 Surface Mount Fuses 12.5×4.5mm Ceramic SMD Chip Fuse 32V 63V |
| 項目名稱: | 1245 SMD Fuse | 零件號: | R1245 |
| 吹氣類型: | Fast, Slow | 安裝類型: | 表面貼裝 |
| 標準: | UL認證 248-14 | 本體材料: | 陶瓷 |
| 帽材料: | Gold Or Silver Plated Brass | 熔融材料: | Cu-Ag Alloy |
| 額定電壓: | 32V 63V 72V 125V 250V | 額定電流: | 15A 20A 25A 30A 40A 50A 60A 80A 100A |
| 應用對象: | 12.45×4.5×4.5 Mm | 符合RoHS標準: | 係 |
| 無鹵素: | 係 | 最小起訂量: | 1500個人電腦 |
| 高光: | 12.5×4.5mm Surface Mount Fuses, 32V Surface Mount Fuses, SMD Chip Fuse | ||
產品描述
1245 Surface Mount Fuse 12.5×4.5 UL Chip Fuse 32V 63V 72V 125V 250V 15A 20A 25A 30A 40A 50A 60A 80A 100A SMD Fuse
描述
| 項目 | 1245 SMD Fuse |
| 標準 | UL認證 |
| 吹氣類型 | fast blow, time delay |
| 本體材料 | 陶瓷 |
| 熔融材料 | Cu-Ag alloy |
| 帽材料 | 黃銅, plated with silver or gold |
| 額定電壓 | 32V 63V 72V 125V 250V |
| 額定電流 | 15A 20A 25A 30A 40A 50A 60A 80A 100A |
| 安裝類型 | 表面貼裝 |
| 分斷能力 | 1嘉 |
| 大小 | 12.45×4.5×4.5 毫米 |
應用
| LED driver | Networking device | Game console |
| Notebook | PC server | Office equipment |
| PC Computer | Cooling fan system | Digital camera |
| Portable Device | Wireless base station | LED/LCD monitor |
| 電源 | Telecom device | lndustrial equipment |
Drawing of the 1245 SMD fuse
Electrical Characteristics at 25℃
| Ampere Rating | % of Current Rating | 吹氣時間 |
| 15A~100A | 100% | >4 小時 |
| 15A~100A | 200% | <60sec |
Normal amperes: 15A 20A 25A 30A 40A 50A 60A 80A 100A
Silver or gold plating is available
Silver or gold plating is available
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